Angstrom Semiconductor Initiative
Overview
To promote the exploratory research on the advanced semiconductor devices, materials, and process monitoring techniques, the program aims for innovative “out-of-box” solutions that could maintain the leading position of Taiwan in the semiconductor industry for the next decade.
Mission and Vision
Semiconductor industry is the economics and safety cornerstone of Taiwan. However, we face challenges continually. Not only other countries strive to nurture relevant industries, also, relevant technologies are facing physical limits. The program expects to solve the key issue of mass production technology in 2030 equivalent beyond 1nm semiconductor.
Program Office
The executive office manages planning executive strategies, forming the advisory committee, and carrying out domestic and international technical exchange activities. Continuing the research and development on the forward-looking nm-scale technologies for semiconductor manufacturing and design not only supports the local semiconductor supply chain but also lays a solid foundation for national economics and security.
Goals & Effectiveness
本計畫欲投入前瞻低維半導體材料與元件關鍵技術開發，並突破半導體晶片技術的發展。除了發展Å尺度檢測技術外、也以開發新穎低維半導體材料技術為基礎，將開發關鍵元件技術作為目標；在半導體晶片技術發展方面，期望達成超高密度三維積體電路技術、與極低能耗元件與運算架構兩大關鍵技術開發。